深圳市邦凱膠粘制品有限公司

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代理韓國UV膜 玻璃/晶圓切割 無殘膠 無飛料 免費(fèi)送樣
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產(chǎn)品/服務(wù): 瀏覽次數(shù):221UV膜  
型 號: BK-78315 
規(guī) 格: 300mm*100m 
品 牌: 邦凱 
單 價(jià): 1.00元/平方 
起訂量: 1 平方 
供貨總量: 900000 平方
發(fā)貨期限: 自買家付款之日起 3 天內(nèi)發(fā)貨
更新日期: 2017-08-19  有效期至:長期有效
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產(chǎn)品屬性
 產(chǎn)品型號:  BK-78315
 產(chǎn)品規(guī)格:  300mm*100m
 產(chǎn)品品牌:  邦凱
產(chǎn)品優(yōu)勢
代理進(jìn)口
詳細(xì)信息
加工定制 厚度 0.17(mm) 適用范圍 玻璃切割 晶圓切割
用途 玻璃保護(hù)膜 品牌 邦凱 材質(zhì) pet
顏色:透明 基材:pet/po 厚度:0.17(mm)
延伸系數(shù): 短期耐溫性:NA(℃) 加工定制:是
寬度:180/210/230/300/330(mm) 膠系:亞克力 長期耐溫性:NA(℃)
型號:BK-78315 適用范圍:玻璃切割 晶圓切割 品牌:LINTEC

我公司專業(yè)代理琳得科ADWILL D系列UV膜,用于玻璃,晶圓,基板,陶瓷片等產(chǎn)品的切割。產(chǎn)品線齊全,價(jià)格優(yōu)勢,歡迎來電咨詢。


Two types of back grinding tape are available. The "E series" which can be removed without placing stress on the wafer by decreasing adhesion by UV irradiation, and the "P series" which is non-UV type. In addition, there is the "S series" peeling tape.

 

  • D series (UV Curable Dicing Tape)

 

Product Information

Si Wafer
Base Material:PVC-PO

  • High Expandability
  • Antistatic
  • Anti-chipping
  • High Adhesion
  • Easy Pick Up

Glass / Ceramics
Base Material:PVC-PET

  • Standard

Package Substrate
Base Material:PO

  • Standard
  • Antistatic

Stealth Dicing
Base Material:PVC-PO

  • Standard

Wafer with LC Tape
Base Material:PO

  • Standard

 

Adwill D series is an epoch-making line of UV curable dicing tapes whose features can be changed in accordance with operational process. The tape's strong adhesion secures wafers during dicing, and then is reduced by UV irradiation to facilitate pick-up. This dicing tape is essential for full-cut dicing of wafers to improve die quality, and fully applicable to dies of multiple sizes.

  1. Secures wafers with strong initial adhesion to ensure dicing without any slipping or peeling even for small dies.
  2. Supports instant control of adhesion by UV irradiation, allowing large dies to be picked up easily.
  3. Causes no contamination by metal ions or by adhesive residue on the wafer backside surface, and no adverse UV irradiation effects on ICs.
  4. Prevents contact damage of dies with superb expandability, which is not reduced by UV irradiation.
  5. Offers a variety of tape grades ranging from a tape with reduced tape chips at high speed, full-cut dicing to a special tape for thin wafers.
  6. Provides special grades not only for wafer dicing but also for package, ceramic or glass dicing.
  7. Provides various not only for blade dicing but also for laser dicing.
  8. Supports the adhesive coating process environment that meets Class 100 (ANSI 209b) standards.

ount tape Adwill D-series specification

Name of tape

D-105V

D-203

D-210

D-218

D-410T

D-510T

D-511T

D-628

D-636

D-636 (LM001B)

D-650

D-667

D-670

D-675

D-820

Tape thickness (um)

90

65

125

203

130

170

170

90

155

95

90

90

90

90

110

Face material / Thickness (um)

PVC / 80

PET / 50

PET / 100

PET / 188

PO / 100

PO / 140

PO / 140

PO / 80

PO / 140

PO / 80

PO / 80

PO / 80

PO / 80

PO / 80

PVC / 100

Color

Blue

Transparent

Transparent

Transparent

Clear

Clear

Clear

Clear

Clear

Clear

Clear

Transparency

Clear

Clear

Blue

Adhesive layer / Thickness (um)

Acrylic / 10

Acrylic / 15

Acrylic / 25

Acrylic / 15

Acrylic / 30

Acrylic / 30

Acrylic / 30

Acrylic / 10

Acrylic / 15

Acrylic / 15

Acrylic / 10

Acrylic / 10

Acrylic / 10

Acrylic / 10

Acrylic / 10

Before UV adhesion (g/inch)

400

2000

2000

1600

2000

2300

1200

1000

1400

1200

350

400

400

200

340

After UV adhesion (g/inch)

35

15

20

25

70

80

30

10

65

100

10

60

60

20

75

Holding power (sec.)

10000

3000

50000

3000

50000

50000

>70000

>70000

50000

50000

>70000

>70000

>70000

>70000

>70000

25% strength MD (kg/cm)

0.8

6

12

>15

1

1.25

1.25

0.8

1.25

0.8

0.8

0.8

0.8

0.8

0.7

25% strength CD (kg/cm)

0.7

6

12

>15

0.9

1.2

1.2

0.7

1.2

0.7

0.7

0.7

0.7

0.7

0.6

Tensile strength MD (kg/cm2)

285

1500

2000

>1000

320

350

350

340

350

320

340

340

340

340

250

Tensile strength CD (kg/cm2)

225

1500

2000

>1000

260

340

340

280

340

270

280

280

280

280

200

Elongation MD (%)

295

120

100

>50

480

570

570

450

570

450

450

450

450

450

300

Elongation CD (%)

285

120

100

>50

530

620

620

500

620

500

500

500

500

500

200

Expandability

Excellent

No good

No good

No good

No good

No good

No good

No good

No good

Fair

No good

Fair

Fair

Good

Excellent

Suitable chip size

>2X2mm

>1X1mm

>1X1mm

>1X1mm

>0.5X0.5mm

>0.5X0.5mm

>0.5X0.5mm

>0.5X0.5mm

>0.5X0.5mm

>0.5X0.5mm

>1X1mm

>1X1mm

>1X1mm

>2X2mm

>2X2mm

Guarantee period (Mon.)

4

6

6

6

5

5

5

5

5

5

8

5

5

5

2

Remark

Expandable tape

For glass & ceramic dicing

For glass & ceramic dicing

For glass & ceramic dicing

For package dicing (CSP, BGA)

For package dicing (CSP, BGA)

For package dicing (CSP, BGA)

For small chip dicing

For small chip dicing

For small chip dicing

For LOC package, Low adhesive residue

Standard dicing tape

Standard dicing tape

Standard dicing tape

Anti-static dicing tape

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